Taiwan Semiconductor Manufacturing has priced a syndicated TWD denominated Zongzi market bond which matures in 2030.
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| Issuer Details | |
| Issuer | Taiwan Semiconductor Manufacturing Co., Ltd. |
| LEI | 549300KB6NK5SBD14S87 |
| Industry | Electronic Equipment and Instruments |
| Country | Taiwan |
| Trade Details | |
| Security Type | Bond |
| Amount | TWD [Login to see full details] |
| Total Amount including taps | TWD [Login to see full details] |
| Total Amount Outstanding | TWD [Login to see full details] |
| Total Order Book | TWD [Login to see full details] |
| Structure | Fixed Rate |
| Coupon | [Login to see full details] |
| Term | [Login to see full details] |
| Yield Notes | [Login to see full details] |
| Trade Date | [Login to see full details] |
| Settlement Date | [Login to see full details] |
| Maturity Date | [Login to see full details] |
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A Zongzi bond is a TWD-denominated bond issued by a Taiwanese entity in the Taiwanese Domestic Bond market.
Check here for all issuer’s year to date financings.